Typical Case Presentation：

These cases exemplify classic failure modes observed during rigorous electronic component testing, performed in accordance with AS6081 and IDEA-STD-1010-B protocols.

SEM& Appearance Analysis & Abrasive Material Identification：

RoHS Testing & Heavy Metal Content Analysis：

DE-CAP Analysis & IC Identification and Verification：

Cross-Sectional Analysis & Chip Vertical Structure Verification：

X-ray analysis & BGA Solder Joint Defect &OPEN：

SEM Analysis&Analysis of the microstructure of the chip cross-section：